Respect of the customer,please contact the sales staff before purchasing module to carry out pre-sale consultation.Otherwise,the module may not meet your needs or modules have no inventory. Detailed specifications docs,please download form the official website. skype:nickren999
F23BUUM13-W2 is a small size and low profile of WiFi + BT Combo module with LGA (Land-Grid Array) footprint, board size is 13.2mm*12.0mm with module thickness of 2mm. It can be easily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides USB interface for WiFi to connect with host processor and high speed USB interface for BT. It also has a PCM interface for audio data transmission with direct link to external audio codec via BT controller. The WiFi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.0.
Operate at ISM frequency bands (2.4GHz) SDIO for WiFi and UART for Bluetooth IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE802.11e, IEEE 802.11h, IEEE 802.11i Fully Qualified for Bluetooth 2.1+EDR specification including both 2Mbps and 3Mbps modulation mode Fully qualified for Bluetooth 3.0 Fully qualified for Bluetooth 4.0 Dual mode Full–speed Bluetooth operation with Piconet and Scatternet support Enterprise level security which can apply WPA/WPA2 certification for WiFi. WiFi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps downstream and 150Mbps upstream PHY rates
Tablet / notebook Advertising machine /TV board OTT/IPTV/DVB/STB DV/ IPC/Mini driving recorder / doorbell Smart TV / intelligent projector Pico VR/AR terminal Wireless storage Printer /POS machine / electronic said Vehicle mounted front / rear terminal UAV / robot Intelligent Gateway Toys Lighting lamps / intelligent street lamps Smart home appliances / appliances Instrument and meter (water, electricity, gas) Smart city and other consumer electronic products